Name: MLA 150 Maskless Aligner
Brand: Heidelberg Instruments
SKU: MFDNQSJS
Availability: InStock

MLA 150 Maskless Aligner

MFDNQSJS

Brand: Heidelberg Instruments

Category: Lithography Tools

Industry: Life Science and Biotechnology, Academia, Material Science & Chemistry

The MLA 150 Maskless Aligner uses advanced DMD-based digital lithography to create precise micro-patterns without traditional photomasks, enabling faster design-to-substrate processing.

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The MLA 150 maskless aligner represents a new generation of lithography systems designed to replace traditional mask-based technology with a faster, more flexible, and easy-to-use solution. By using a Digital Mirror Device (DMD) as a dynamic mask, the system eliminates the need for physical photomasks, significantly reducing both cost and turnaround time in microfabrication workflows.

Unlike conventional photolithography systems, the MLA 150 allows researchers and engineers to move directly from a digital design to a perfectly patterned substrate within minutes. This maskless approach enables rapid prototyping, design iteration, and highly precise patterning, making it ideal for modern research environments where speed and flexibility are essential.

The MLA 150 provides outstanding performance and accuracy for a wide range of advanced applications including quantum device fabrication, MEMS development, micro-optics, photonics, and life sciences research. Its intuitive software interface and streamlined workflow allow users to easily modify patterns, test new designs, and accelerate experimental development without the delays associated with mask production.

With its combination of high resolution, digital mask flexibility, and fast processing, the MLA 150 maskless aligner has become a preferred solution for research laboratories, universities, and semiconductor innovation centers working on next-generation micro and nanofabrication technologies.

Labindia Instruments Pvt. Ltd. is the authorised dealer in India, providing advanced lithography and microfabrication solutions for semiconductor, nanotechnology, and research laboratories.

Maskless Lithography Technology – Uses a Digital Mirror Device (DMD) to create patterns directly from digital designs, eliminating the need for physical photomasks.
Dual Laser Wavelength Options – Supports 375 nm and 405 nm lasers, enabling exposure of broadband, g-line, h-line, and i-line photoresists without hardware changes.
Wide Substrate Compatibility – Specialized vacuum chucks allow processing of small substrates (3×3 mm²), thin foils, and warped wafers with ease.
Grayscale Exposure Capability – Enables fabrication of 2.5D microstructures and complex surface topographies for advanced microfabrication.
High-Aspect-Ratio Patterning – Designed to pattern thick resists with steep sidewalls, ideal for MEMS and microfluidic applications.
Interactive Draw Mode – Allows users to draw patterns directly on the live camera image, perfect for rapid prototyping and precise alignment on unique structures.
Sub-Micron Resolution – Achieves feature sizes down to 0.45 µm, supporting high-precision device fabrication.
High Throughput Performance – Capable of exposing a 150 mm wafer in less than 16 minutes for efficient processing.
Automated Alignment System – Provides 250 nm alignment accuracy with digital compensation for rotation, scaling, offset, and distortion.
Dynamic Autofocus Technology – Ensures consistent focus and uniform pattern quality, even on uneven or delicate substrates.
Temperature-Controlled Environment – Integrated chamber with ±0.1°C laminar airflow control for maximum stability and repeatable results.
Low Cost of Ownership – Eliminates photomask costs, reduces maintenance, and features long laser lifetime (10–20 years) for economical operation.
Perfect for Multi-User Facilities: Less than 1h training to fully qualify as a user

Module	Functionality
Exposure Wavelength	Diode lasers at 375 nm and/or 405 nm; interchangeable for different photoresists
Exchangeable Chucks	Custom vacuum layouts for various substrates
Draw Mode	Overlay BMP files on live camera image for direct patterning
Autofocus	Air-gauge or optical autofocus for small samples (<10 mm)
Variable Substrate Sizes	3–6″ standard; up to 8″ on request
Advanced Field Alignment	Automatic field-by-field alignment for individual dies on the wafer

Write Mode I *	Write Mode II *
Writing performance
Minimum feature size [μm]	0.6 (0.45 optional)	1
Minimum Lines and Spaces [μm]	0.8 (0.45 optional)	1.2
Global 2nd layer alignment [nm]	500	500
Local 2nd layer alignment [nm]	250	250
Backside alignment [nm]	1000	1000
Max. write speed 405 nm laser [mm²/min]	400	1400
Max. write speed 375 nm laser [mm²/min]	400	600

System features
Light source	Diode lasers: 8 W at 405 nm, 2.8 W at 375 nm, or both
Substrate sizes	Variable: 3 x 3 mm² to 9″ x 9″ \| Customizable on request
Substrate thickness	0 - 12 mm
Maximum exposure area	150 x 150 mm² \| Optional: 200 x 200 mm²
Temperature controlled flow box	Temperature stability ± 0.1 °C
Real-time autofocus	Air-gauge or optical
Autofocus compensation range	180 μm
Grayscale	128 gray levels
Software features	Exposure wizard, resist database, automatic labeling and serialization, Draw Mode for CADless exposures, substrate tracking / history

System dimensions (lithography unit)
Height × width × depth	1950 mm × 1300 mm × 1300 mm
Weight	1100 kg

Installation requirements
Electrical	230 VAC ± 5%, 50/60 Hz, 16 A
Compressed air	6 - 10 bar

Nanofabrication: Quantum devices, 2D materials, semiconductor nanowires
MEMS & MOEMS: Sensors, actuators, micro-optical elements, microfluidics
Materials Science: Patterning of novel materials
Life Sciences: Lab-on-a-chip devices, biosensors

MLA 150 Maskless Aligner | Digital Lithography | Heidelberg Instruments