Sentech Plasma Etching system
ATMMDGU5
Brand: Sentech
Category: Plasma Process Technology
Industry: Academia, Semiconductors, Material Science & Chemistry
Discover the SENTECH modular and flexible plasma processing systems for low-damage, high-rate, and high-selectivity etching.
The Sentech Plasma Etching Systems — comprising the ICP-RIE SI 500, RIE EtchLab 200, and RIE SI 591 Compact — deliver high-precision, flexible, and reliable plasma etching solutions for advanced research and production.
- Cost-effectiveness
- Upgradeability
- SENTECH control software
- Remarkable Material Etching Flexibility
- Excellent process stability
- Excellent uniformity
- Low-damage cryogenic etching
- Deep silicon etching using cryogenic processing
- The SENTECH proprietary plasma source technology
- Dynamic temperature control
- Precise low-ion‐energy/ion bias control with PTSA Source
- Dynamic temperature and backside cooling control
- In-situ monitoring and efficient gas handling
- Process flexibility
- Small footprint and high modularity
- SENTECH control software
- Low-damage ICP-RIE etching
- Simple high-rate etching
- The SENTECH proprietary Plasma Source Technology
- Dynamic temperature control
Plasma etching underpins nearly every modern semiconductor manufacturing process, from transistor gate definition to MEMS sensor release. Its ability to deliver nanometre-scale accuracy, material selectivity, and repeatability makes it indispensable for industries including:
- Integrated circuits (ICs) and logic devices
- Microelectromechanical systems (MEMS)
- Photonics and optoelectronics
- Power electronics and RF components
Without plasma etching, the miniaturisation, performance, and reliability of today’s electronic devices would be impossible.
| Application Images | Description |
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Low damage 20 nm SiGe nano wire |
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Nano structuring AlGaAs / GaAs quantum dots |
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Cryogenic etching Etching of silicon with SF6/O2 at -100°C |
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ICP power independent low energy distribution of PTSA plasma source |
