SENTECH’s spectroscopic ellipsometers are designed for non-destructive optical analysis of thin films, multilayers, and bulk materials. They measure film thickness, refractive index, anisotropy, and surface/interface roughness — with exceptional accuracy and speed.

Each model is optimized for a specific application domain, from research-grade systems to automated industrial metrology:

• SENresearch 4.0 — Ultimate Spectroscopic Ellipsometry Performance
  Engineered for the widest spectral range (190–3500 nm), the SENresearch 4.0 supports full Mueller matrix, anisotropy, and generalized ellipsometry. Its Step Scan Analyser principle ensures ultra-high accuracy and stability, ideal for advanced R&D, optical modeling, and complex material systems.

• SENpro — Smart, Cost-Effective Ellipsometry
  A compact and easy-to-use solution offering goniometer-based angle control in 5° steps, SENpro combines rapid measurements, intuitive analysis software, and high precision. Perfect for routine film thickness and refractive index measurements, it balances performance with affordability.

• SENDIRA — Infrared Spectroscopic Ellipsometry
  The FTIR-based SENDIRA provides vibrational spectroscopy for analyzing molecular orientation, bonding states, and chemical composition of thin films. Ideal for studying polymer films, organic layers, and conducting materials, it enables measurement of charge carrier concentration and infrared absorption spectra.

• SENDURO® — Automated Spectroscopic Ellipsometry
  Designed for routine and production environments, SENDURO® features recipe-driven automation, automatic sample alignment, and real-time analysis — delivering results within seconds. It’s the ideal system for quality control and high-throughput R&D.

• SENDURO® MEMS — Automated Wafer Metrology for MEMS and Sensors
  Specifically developed for MEMS production, sensor fabrication, and double-sided wafer processing, the SENDURO® MEMS combines spectroscopic ellipsometry and reflectometry. With cassette-to-cassette wafer handling and edge grip technology, it ensures precise backside protection and reliable thin-film characterization in automated workflows.

Core Technologies

Spectroscopic Ellipsometry

• Non-destructive optical technique for film thickness and refractive index measurement.

• Analyzes single layers, multilayer stacks, and gradient films.

• Applicable to isotropic and anisotropic materials.

Full Mueller Matrix & Anisotropy Analysis (SENresearch 4.0)

• Captures the complete polarization state of light.

• Essential for studying complex, birefringent, or nanostructured materials.

• Enables generalized ellipsometry and scatterometry.

Infrared Ellipsometry (SENDIRA)

• Measures vibrational absorption bands for molecular analysis.

• Determines orientation of long-chain molecules and chemical composition.

• Ideal for conductive films and organic/inorganic hybrid materials.

Automated Metrology (SENDURO® Series)

• Fully automated measurement and data analysis.

• Recipe-based operation with rapid result output.

• Designed for quality control, R&D, and production testing.

Edge Grip Wafer Handling (SENDURO® MEMS)

• Prevents backside contamination during MEMS or sensor wafer processing.

• Supports double-sided wafers and standard cassette loading.

• Enables high-precision optical metrology in production lines.

• Thin Film Characterization — Optical constants, refractive index, and thickness.

• Semiconductor Metrology — Process control in device and MEMS fabrication.

• Organic and Polymer Films — Molecular orientation and bonding studies.

• Anisotropic and Nanostructured Materials — Full polarization and Mueller matrix analysis.

• Infrared Spectroscopy — Chemical composition and charge carrier concentration.

• Quality Control & Production Metrology — Automated, repeatable thin-film testing.

• Research & Development — For materials science, photonics, and quantum materials.