TESCAN AMBER X2 for Materials Science

• Integrated Plasma FIB-SEM System: Combines Mistral™ Plasma FIB and a field-free SEM column for advanced multimodal analysis

• Market-Leading Plasma FIB Resolution: Exceptional precision in both imaging and sample preparation

• Universal FIB Capability: Suitable for TEM/STEM specimen prep and large-volume material removal

• Contamination-Free Milling: Eliminates Ga⁺ metal contamination common in traditional FIB systems

• High Throughput Performance: Rapid milling and analysis for faster turnaround times

• Minimal Ion Damage: Preserves structural and chemical integrity of sensitive materials

• Correlative Multimodal Characterization: Enables seamless 2D/3D structure and chemistry analysis

• Field-Free SEM Column: Enhances contrast and analytical performance without interference

• User-Centric Interface: Streamlined control and automation for ease of operation

Plasma FIB-SEM, Redefined.
The TESCAN AMBER X2 is a new generation plasma FIB-SEM — combining unmatched FIB resolution, damage-free sample preparation, and correlative multimodal imaging.
With its Mistral™ Plasma FIB column, field-free SEM, and high-throughput analytical capabilities, AMBER X2 delivers the speed, precision, and versatility needed for the most demanding materials science, semiconductor, and nanotechnology applications.
It’s not just an instrument — it’s the benchmark for the future of FIB-SEM innovation.

• TEM/STEM Sample Preparation
  Create ultra-thin lamellae with minimal damage and contamination for high-resolution microscopy.

• 3D Microstructural Analysis
  Perform precise, large-volume cross-sectioning and reconstruction for in-depth materials characterization.

• Failure and Defect Analysis
  Investigate structural or chemical irregularities in semiconductors, composites, and alloys with sub-nanometer detail.

• Correlative Multimodal Characterization
  Integrate imaging, EDS, EBSD, and FIB-based tomography in a unified analytical workflow.

• Nanofabrication and Material Engineering
  Execute precise micromachining and nanoscale modifications for prototype development and surface engineering.