The TESCAN MIRA is engineered for professionals who demand uncompromising analytical power, image clarity, and workflow efficiency.
Featuring a high-brightness FEG Schottky electron source, the system achieves exceptional resolution and signal-to-noise performance, even at low accelerating voltages, making it ideal for surface-sensitive and nanostructured materials.
Through TESCAN Essence™ software, users gain unified access to SEM imaging and live EDS elemental analysis, simplifying the acquisition and correlation of both morphological and compositional data.
This seamless integration transforms the way laboratories conduct high-throughput inspections, enabling faster, more intuitive workflows without sacrificing analytical depth.
Advanced technologies like In-Flight Beam Tracing™ and Wide Field Optics™ ensure optimal beam alignment and effortless sample navigation.
Meanwhile, SingleVac™ mode supports imaging of beam-sensitive or non-conductive samples without compromising surface integrity.
Enhanced by optional in-column SE/BSE detectors and Beam Deceleration Technology, MIRA delivers remarkable imaging contrast, resolution, and analytical accuracy across diverse research and industrial environments.
Core Technologies
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In-Flight Beam Tracing™
Real-time modeling ensures optimum imaging and analytical conditions without manual aperture adjustment.
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Wide Field Optics™
Enables ultra-wide sample navigation and region targeting down to ultra-low magnifications.
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SingleVac™ Mode
Allows imaging of non-conductive and delicate samples under low-vacuum conditions, preventing charge accumulation.
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Essence™ EDS Integration
Unified imaging and analysis interface for live, correlated morphological and elemental data.
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Essence™ 3D Collision Model
Provides chamber visualization to protect detectors and samples during movement.
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Beam Deceleration Technology (Optional)
Achieves enhanced surface sensitivity and contrast at lower accelerating voltages.
