XP1E55ZY
Brand: Tescan
Category: Scanning Electron Microscopes
Industry: Life Science and Biotechnology, Academia, Semiconductors, Material Science & Chemistry, Paint, Pigments & Polymers
The TESCAN AMBER X sets the benchmark for field-free analytical ultra-high-resolution scanning electron microscopy (UHR SEM).
It enables uncompromised nanoscale characterization of all material types, including magnetic, non-conductive, and beam-sensitive samples, without the influence of magnetic fields.
Equipped with In-Flight Beam Tracing™, Wide Field Optics™, and advanced low-energy beam control, AMBER X delivers superior surface topography, compositional contrast, and analytical accuracy — even at the lowest beam energies.
The TESCAN CLARA is a field-free analytical ultra high-resolution scanning electron microscope (UHR SEM) meticulously designed for materials characterization at the nanoscale.
Its field-free objective lens architecture ensures uncompromised imaging of magnetic, non-conductive, or beam-sensitive materials, while maintaining nanometer-scale resolution at both high and low beam energies.
The system incorporates In-Flight Beam Tracing™ — TESCAN’s proprietary beam optimization system — which guarantees ideal imaging conditions automatically, without manual alignment.
Meanwhile, Wide Field Optics™ provides intuitive live SEM navigation at magnifications as low as 2×, eliminating the need for a secondary optical camera.
The In-Beam Multidetector design allows angle- and energy-selective BSE detection, enabling unparalleled topographic and compositional contrast.
Together with the modular Essence™ software platform, CLARA delivers an effortless, high-throughput imaging and analytical experience for users of all skill levels.
True Field-Free Objective Lens — Enables imaging of magnetic and beam-sensitive materials without distortion or loss of resolution.
Ultra High-Resolution (UHR) Imaging — Achieves sub-nanometer resolution for advanced surface characterization.
In-Flight Beam Tracing™ — Ensures automatic beam optimization for ideal imaging conditions without manual intervention.
Wide Field Optics™ — Offers live SEM navigation at magnifications as low as 2×, eliminating the need for optical navigation cameras.
In-Beam Multidetector System — Supports angle- and energy-selective BSE detection for superior contrast and analytical flexibility.
Modular Essence™ Software Platform — Intuitive, modular interface designed for seamless imaging and analysis, adaptable to all user experience levels.
Fully Motorized Eucentric 5-Axis Stage — Provides precise, automated sample positioning and navigation with a large motion envelope.
True Field-Free Imaging. Uncompromised Resolution. Universal Material Compatibility.
The TESCAN CLARA Field-Free Analytical UHR SEM enables unmatched imaging of all materials — from magnetic alloys to fragile polymers — without compromise.
Featuring In-Flight Beam Tracing™, Wide Field Optics™, and In-Beam Multidetector technology, CLARA combines ultra-high-resolution imaging, effortless navigation, and superior analytical precision.
It’s the ultimate choice for researchers and engineers seeking maximum performance, minimal complexity, and total material freedom in one analytical platform.
| Parameter | Specification |
|---|---|
| Technology Platform | Field-Free Analytical Ultra High-Resolution SEM |
| Resolution (Achievable) | 0.5 nm at 15 keV* • 0.8 nm at 1 keV* (Subject to ideal installation conditions) |
| Probe Current | 2 pA – 400 nA, continuously adjustable |
| Objective Lens | Field-Free design for distortion-free imaging of magnetic materials |
| Beam Control | In-Flight Beam Tracing™ |
| Navigation System | Wide Field Optics™ (2× to nanometer-scale navigation) |
| Detector System | In-Beam Multidetector (angle/energy selective BSE detection) |
| Stage Configuration | 5-axis motorized eucentric SW-controlled stage |
| Stage Travel Range (X/Y) | 130 mm |
| Stage Travel Range (Z) | 95 mm |
| Tilt Range | –60° to +90° |
| Rotation | 360° continuous |
| Software Interface | Essence™ modular platform for imaging and analytics |
| Sample Compatibility | Conductive, non-conductive, beam-sensitive, and magnetic materials |
Magnetic & Non-Conductive Material Characterization
Field-free design ensures distortion-free imaging of magnetic and insulating specimens.
Nanomaterial and Thin Film Analysis
Achieve ultra-high-resolution imaging and compositional contrast at low beam energies.
Surface Topography Studies
Reveal nanoscale surface details with exceptional depth and sensitivity.
Failure Analysis (FA)
Detect microcracks, interfacial delamination, and nanoscale defects with unmatched clarity.
Research & Academia
A powerful, intuitive tool for fundamental materials research, teaching, and advanced microscopy training.
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