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Brand: Tescan
Category: Microscope - Scanning Electron
Industry: Semiconductors, Material Science & Chemistry, Cement, Iron & Steel
The TESCAN AMBER X combines the power of a Plasma Focused Ion Beam (FIB) with an Ultra-High-Resolution Field-Free FE-SEM, delivering unmatched performance in multiscale materials characterization.
Engineered for high-throughput milling, Ga-free sample preparation, and ultra-sharp imaging, the AMBER X is the system of choice for scientists and engineers who demand both speed and precision — from the micrometer down to the nanometer scale.
The TESCAN AMBER X represents a new class of Plasma FIB-SEM platforms designed to bridge the gap between macro-level structure and nanoscale detail in materials science.
Its high-current Xe+ Plasma FIB column enables rapid, large-volume milling — up to 1 mm — while maintaining precision and uniformity, making it ideal for 3D tomography, subsurface defect analysis, and microsample preparation.
Unlike conventional Ga+ systems, the Ga-free architecture eliminates ion contamination, ensuring pristine sample surfaces and accurate compositional data — essential for analytical workflows and correlative techniques such as EBSD, EDS, or SIMS.
The system’s field-free ultra-high-resolution FE-SEM delivers artifact-free imaging across all magnifications, enabling accurate topographical, compositional, and structural analysis.
Its in-lens SE and BSE detectors provide crisp, contrast-rich images that reveal the finest microstructural and compositional details.
With an emphasis on throughput, flexibility, and ease of use, the AMBER X empowers researchers to confidently move from sample preparation to data acquisition in a single, integrated platform.
High-Throughput Plasma FIB Milling — Process large sample areas up to 1 mm rapidly and efficiently.
Ga-Free Microsample Preparation — Preserve true sample chemistry for accurate compositional analysis.
Ultra-High-Resolution FE-SEM — Achieve exceptional imaging clarity with field-free electron optics.
In-Lens SE and BSE Detection — Capture topographic and compositional contrast simultaneously.
Multiscale Workflow Integration — Combine microstructural and nanoscale analysis in one platform.
Automated 3D Tomography — Generate high-resolution, volumetric reconstructions for materials research.
Correlative Compatibility — Seamlessly integrates with EBSD, EDS, and other analytical modules.
Intuitive Control Interface — Modular, GUI-driven operation for efficient data acquisition and navigation.
The Power of Plasma. The Precision of Field-Free SEM.
The TESCAN AMBER X redefines multiscale materials characterization — combining Plasma FIB milling with Ultra-High-Resolution field-free FE-SEM imaging in one seamless platform.
From bulk-scale 3D reconstructions to atomic-level imaging, it empowers researchers to explore materials with speed, clarity, and accuracy — without the limits of gallium contamination or resolution trade-offs.
Ideal for materials science, semiconductors, and nanotechnology, AMBER X transforms discovery into insight — faster than ever before.
| Parameter | Specification |
|---|---|
| Ion Source | Xenon (Xe+) Plasma FIB |
| Maximum Milling Area | Up to 1 mm |
| Electron Column | Field-Free UHR FEG-SEM |
| Detectors | In-Lens SE, In-Lens BSE, and Optional STEM/EDS |
| Microsample Preparation | Ga-free lift-out and cross-section capability |
| Imaging Resolution | Sub-nanometer at low kV |
| User Interface | Modular GUI with workflow automation |
| Application Modes | 3D Tomography, Cross-sectioning, Analytical Microscopy |
Advanced Materials Research — Study microstructure, interfaces, and phase boundaries at nanoscale precision.
Semiconductor Analysis — Perform defect localization, layer characterization, and cross-sectional imaging.
Failure Analysis (FA) — Rapidly expose and analyze structural or electrical faults.
3D Tomography — Generate high-resolution volumetric reconstructions of complex materials.
Additive Manufacturing — Assess porosity, inclusions, and bonding at microscale levels.
Energy Materials — Investigate battery cathodes, fuel cells, and corrosion-resistant coatings.
Nanotechnology — Explore nanostructures with exceptional imaging contrast and accuracy.
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