Spectroscopic ellipsometers measure film thickness and refractive index of single layers, and multi layer stacks. Related properties of bulk materials, isotropic and anisotropic materials, surface and interface roughness as well as gradients can be analysed.
SENresearch 4.0 : Spectroscopic ellipsometry
The new SENresearch 4.0 is designed for spectroscopic ellipsometry in the widest spectral range from 190 nm (deep UV) to 3,500 nm (NIR). Every SENresearch 4.0 is a customer-specific spectroscopic ellipsometry solution. The SENresearch 4.0 can be configured for full Mueller matrix, anisotropy, generalized ellipsometry, scatterometry measurement and more. Best measurement results are achieved using the Step Scan Analyser principle.
SENpro : spectroscopic ellipsometry
The SENpro ellipsometer is the smart solution to spectroscopic ellipsometry applications. It features a goniometer with angles of incidence in 5??-steps. Easy operation, rapid measurement, and intuitive data analysis are combined in a cost-effective design for measuring thickness and optical constants of single films and multilayer stacks.
SENDIRA : Infrared spectroscopic ellipsometry
Vibrational spectroscopy is featured by the FTIR ellipsometer SENDIRA. Measuring the absorption bands of molecular vibrational modes in the infrared, the orientation of long molecule chains and the composition of thin films are analysed. Infrared spectroscopic ellipsometry is suited for measuring charge carrier concentration of conducting films.
SENDURO® : Automated spectroscopic ellipsometry
Automated spectroscopic ellipsometry by SENDURO® comprises recipe based quick data analysis within a few seconds. The ellipsometer is designed for easy operation: Placing the sample, automatic sample alignment, automated measurement and analysis, result. Using spectroscopic ellipsometry in the automatic mode is perfectly suited for routine applications in quality control and R&D.
SENDURO® MEMS
The SENDURO® MEMS provides reliable and precise measurement of thin film stacks, using spectroscopic reflectometry and ellipsometry. Wafers are loaded from standard cassettes and recipes carry out the quality control measurements. In Sensor and MEMS production, often, double-sided wafers are processed and backside protection is mandatory. TheSENDURO?MEMS offers advanced edge grip technology for wafer backside protection
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