DWL 66+

The Versatile Tool For Research And Prototyping With Variable Resolution And A Large Selection Of Modules For Easy Customization

The DWL 66+ laser lithography tool is a high-resolution direct-write pattern generator. As an allrounder, the DWL 66+ is ideal for research and development (R&D) in microelectronics, MEMS, microfluidics, sensors, non-standard substrates, advanced packaging — virtually any academic application that requires microstructure fabrication. The DWL 66+ stands out with its Grayscale Exposure Mode which creates complex 2.5D microstructures such as micro-optics for mobile applications, diffractive optical elements (DOE), computer-generated holograms, and structured surfaces.

It is a highly flexible and customizable system that precisely matches the requirements of your applications. Among the key features of the DWL 66+ are a high-resolution mode, front- and backside alignment, absolute position calibration and an automatic loading system.


Product Highlights :
Exposure Quality

CD uniformity 60 nm; edge roughness 50 nm; 2nd layer alignment 500 nm; autofocus compensation 80 µm

Grayscale Lithography

Up to 1000 gray levels; dedicated GenISys BEAMER software for optimizing the exposure of complex geometries

Versatility

Choice of 6 write modes with 2 laser wavelengths; 3 grayscale exposure regimes; highest amount of additional modules available including automation options


Available Modules :
6 Write Modes

Min. features from 300 nm to 4 µm

Exposure Wavelength

Diode laser at 375 nm or 405 nm

Autofocus

Air-gauge or optical autofocus for perfect exposure of small samples (less than 10 mm)

Variable substrate

Size from 3 mm to 230 mm

2 Grayscale Modes

Up to 1000 gray levels and a dedicated GenISys BEAMER software for optimizing the exposure of complex geometries

High-Accuracy Option

Various technical measures to improve the thermal stability and position accuracy of the stage’s coordinate system. Improved specifications for 2nd layer alignment: 350 nm

Automatic Loader

Handling of masks up to 7″ and substrates up to 8″. Optional second cassette station. Pre-aligner and wafer scanner available

Basic Freeform (BFF)

Exposures on non-planar substrates with features down to 3 μm. Typical applications are microstructures on top of convex or concave lenses

Vector Scan Mode

Patterns structures and shapes consisting of curved lines where smooth contours are required


Technical Data
Write mode HiRes I II III IV V
Writing performance
Minimum Feature Size [μm] 0.3 0.6 0.8 1 2 4
Minimum Lines and Spaces [μm] 0.5 0.8 1 1.5 3 5
Address Grid [nm] 5 10 25 50 100 200
Edge Roughness [3σ, nm] 50 50 70 80 110 160
CD Uniformity [3σ, nm] 60 70 80 130 250 400
2nd Layer Alignment over 5 x 5 mm² [nm] 250 250 250 250 350 500
2nd Layer Alignment over 100 x 100 mm² [nm] 500 500 500 500 800 1000
Backside Alignment [nm] 1000 1000 1000 1000 1000 1000
With Diode Laser (405 nm)
Write speed [mm²/min] 3 13 40 150 600 2000
Exposure Time for 100 x 100 mm² area [min] 3000 740 255 72 20 7
With UV Diode Laser (375 nm)
Write Speed [mm²/min] 2 10 30 110 - -
Exposure Time for 100 x 100 mm² area [min] 5000 1015 350 100 - -
System features
Light Source Diode laser with 405 nm or 375 nm
Substrate Sizes Variable: 5 x 5 mm² to 9″ x 9″ | Customizable on request
Substrate Thickness 0 to 12 mm
Maximum Exposure Area 200 x 200 mm²
Temperature controlled Flow Box Temperature stability ± 0.1°, ISO 4 environment
Real-Time Autofocus Optical autofocus or air-gauge autofocus
Autofocus Compensation Range 80 μm
Standard or Advanced Grayscale Mode 128 / 256 gray levels respectively
Vector Mode Enables the writing of stitching-free lines
Overview Camera 8 x 10 mm² field of view facilitates alignment to marks and substrate navigation
Backside Alignment (optional) Allows the alignment of exposures to structures on the backside of the substrate
Advanced Options - Performance Upgrades
High-Accuracy Coordinate System Includes golden plate calibration and climate monitoring: 2nd layer alignment down to 350 nm
Professional Grayscale Mode 1024 gray levels, professional data conversion software
Automatic Loading System Handling of masks up to 7" and wafers up to 8" with two carrier stations, pre-aligner and wafer scanner
System Dimensions of Standard Version
Width × depth × height 1300 mm × 1100 mm × 1950 mm (lithography unit only)
Weight 1000 kg (lithography unit only)
Installation requirements
Electrical 230 VAC ± 5 %, 50/60 Hz, 16 A
Compressed air 6 - 10 bar
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